UV Adhesion Reduction Tape Series

Product Features

High initial adhesion for firm bonding

Low adhesion after UV irradiation for easy peeling

Solves difficult bonding and fixing issues

Product Structure

jiegou-EN


Technical Parameters

Effective

Dependson the actual situation of the customer.

Inspection Items

Specification value

Test Method/Instrument

Total thickness (adhesive layer + basematerial)

65±5μm

ASTM D3652

Base material thickness

50±3μm

Peeling force to steel plate

2300±300gf/25mm

ASTM D3330

Peeling force to the steel plate after UVirradiation

<5gf/25mm

Peeling force of the release film to theadhesive layer

≤6gf/25mm

Surface impedance value

The back side of the release film

106-10Ω

ASTM D257

Adhesive surface

106-10Ω

Base material surface

106-10Ω

Light transmittance

≥88%

ASTM D1003

Haze

≤3%

Note: Test temperature: 23±2℃, test relative humidity: (50±5)%RH.


Quality certification

ROHS environmental certification

ISO9001 quality certification

ROSH  ISO 

Product Application

In the optical field: Grooving, cutting and pickling of various coated glass, ordinary glass ceramics, etc.

During processing, high adhesive force and strong adhesion are required. After processing, the adhesive tape needs to be removed. For example, it is used for the assembly support adhesion of 2.5D/3D curved touchscreens and the assembly support adhesion of flexible OLED touchscreens.

In the packaging field: Cutting of various packaged components and cutting and grinding of wafers.


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