High initial adhesion for firm bonding
Low adhesion after UV irradiation for easy peeling
Solves difficult bonding and fixing issues
Effective | Dependson the actual situation of the customer. | ||
Inspection Items | Specification value | Test Method/Instrument | |
Total thickness (adhesive layer + basematerial) | 65±5μm | ASTM D3652 | |
Base material thickness | 50±3μm | ||
Peeling force to steel plate | 2300±300gf/25mm | ASTM D3330 | |
Peeling force to the steel plate after UVirradiation | <5gf/25mm | ||
Peeling force of the release film to theadhesive layer | ≤6gf/25mm | ||
Surface impedance value | The back side of the release film | 106-10Ω | ASTM D257 |
Adhesive surface | 106-10Ω | ||
Base material surface | 106-10Ω | ||
Light transmittance | ≥88% | ASTM D1003 | |
Haze | ≤3% |
ROHS environmental certification
ISO9001 quality certification
In the optical field: Grooving, cutting and pickling of various coated glass, ordinary glass ceramics, etc.
During processing, high adhesive force and strong adhesion are required. After processing, the adhesive tape needs to be removed. For example, it is used for the assembly support adhesion of 2.5D/3D curved touchscreens and the assembly support adhesion of flexible OLED touchscreens.
In the packaging field: Cutting of various packaged components and cutting and grinding of wafers.